By Andrea Chen,Randy Hsiao-Yu Lo
In semiconductor production, knowing how quite a few fabrics behave and engage is important to creating a competent and strong semiconductor package deal. Semiconductor Packaging: fabrics interplay and Reliability offers a basic figuring out of the underlying actual homes of the fabrics utilized in a semiconductor package deal.
The publication makes a speciality of a big step in semiconductor manufacturing—package meeting and checking out. It covers the fundamentals of fabric houses and explains find out how to verify which behaviors are very important to package deal functionality. The authors additionally talk about how the homes of packaging fabrics have interaction with every one one other and discover how one can maximize the functionality of those fabrics in regard to package deal integrity and reliability.
By tying jointly the disparate components necessary to a semiconductor package deal, this easy-to-read publication indicates how the entire components healthy and interact to supply sturdy safety for the built-in circuit chip inside of in addition to a way for the chip to speak with the surface world.
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Semiconductor Packaging: Materials Interaction and Reliability by Andrea Chen,Randy Hsiao-Yu Lo